Low Residue (No-Clean) Processes

PACIFIC NORTHWEST POLLUTION PREVENTION RESEARCH CENTER

POLLUTION PREVENTION RESEARCH PROJECTS DATABASE



Project Title:  Low Residue (No-Clean) Processes



Date Last Updated:      12/95



Project Summary:  A four-part program is to help ease implementation for

manufacturers who have chosen, or are considering, the "no-clean" option

as an alternative to using chlorofluorocarbon (CFC) cleaning solvents.  The

program will educate potential users by identifying critical process

modifications that need to be considered when using this technology.  The

EMPF staff assists government program offices and contractors by helping

them to understand this new technology.



1.  Hand Soldering - The EMPF is evaluating process parameters and

soldering techniques for low-residue fluxes compared to rosin fluxes when

performing hand solder and rework/repair.  The goal is to determine and

deploy optimal hand soldering methods and techniques to commercial and

military industry and field repair activities.  Information based on

industry experience and input will be transferred using hands-on

demonstration by the Electronics Manufacturing Learning Center (EMLC),

consulting and publications.



2.  Solderability - Component and board solderability testing techniques

and acceptance criteria, as well as board design parameters associated

with using a low-residue soldering process, are being evaluated.  This

project is building on the EMPF's earlier Fluxless Soldering and

Sequential Electrochemical Reduction Analysis (SERA) Technology

projects.  This work has been completed and a detailed report will be 

released inthe 2nd quarter 1996.



3.  Demonstration Factory - Through actual demonstration and hands-on

experience on the EMPF factory floor, the EMLC is teaching a

3-day course called Low Residue (No-Clean) Soldering Process

Implementation.  It was developed by an experienced industry team who

has already successfully implemented no-clean processes.

The following is the 1996 schedule for the Low Residue/No-clean Soldering 

Process Implementation class:

Jan 16-18, Feb 20-22, Mar 26-28, Apr 23-25, May 21-23, Jun 9-11, 

Aug 27-29, Oct 1-3, Nov 12-14, Dec 2-5



4.  Low-Residue Soldering Task Force - The EMPF is part of a task force,

along with Sandia National Labs, the Navy, Army, Air Force, Department

of Energy, and EPA, specifically focused on low-residue soldering

technology for defense contractors.  Phase 1, which has been completed,

utilized 3 test vehicles to evaluate the long-term effects of low residue

flux residues (both in an uncleaned and a cleaned state). Phase 2 is

complete.  A full report is avialable from Mr. Ron Iman, Sandia National 

Labs, (505) 844-8834.



5.  MCM To PWB Assembly Process - This project will consider the issues

concerning large component (MCM in particular) attachment to PWBs.  These

devices can have many hundreds of leads with relatively tight spacing (25

mils or less).  These packages in conjunction with large fine-pitch QFP

packages, and extremely high pin count SMT connectors and crossovers,

cause problems in military electronic module production.  This project

will examine a variety of production tools to improve throughput and yield

for attachment processes.  Inspection and repair issues are of special

interest with these ultra high value devices.  Information and assistance 

concerning this effort is made available thorugh the EMPF Helpline (317) 

226-5607.



Project Keywords: electronics, manufacturing, clean, flux, solder,

chloroflurocarbon, CFC, rosin, residue,



Organization Performing Research: Electronics Manufacturing Productivity

Facility (EMPF)



Primary Research Contact:

Tim Crawford

Electronics Manufacturing Productivity Facility (EMPF)

714 North Senate Avenue

Indianapolis, Indiana 46202-3112

Phone:  (317) 226-5634   FAX:  (317) 226-5615



Date Research Started/Completed:   Not reported



Publications Based on Research:

Sandia Nationa Labs - Report from Low Residue Soldering Task Force - call 

Mr. Ron Iman, (505) 844-8834.



EMPF Low Residue (No-clean) Soldering Process Implementation course.  Call

EMPF's Electronics Manufacturing Learning Center (317) 226-5683



Low Residue (No-clean) Slodering Process Implementation Video - Available 

through IPC (International Institute for Interconnecting and Packaging of 

Electronics Circuits.



Approximate Project Budget:   Not reported



Primary Project Funder:  Electronics Manufacturing Productivity Facility

(EMPF)



Funder Contact:

William J. Baldwin, Manager, Technology Transfer

Electronics Manufacturing Productivity Facility (EMPF)

714 North Senate Avenue

Indianapolis, Indiana 46202-3112

Phone:  (317) 226-5688   FAX:  (317) 226-5615

Funder's Internet:  http://www.engr.iupui.edu/empf/