Conductive Adhesives / Lead-Free Solder

PACIFIC NORTHWEST POLLUTION PREVENTION RESEARCH CENTER

POLLUTION PREVENTION RESEARCH PROJECTS DATABASE



Project Title:  Conductive Adhesives / Lead-Free Solder



Date Last Updated:    12/95



Project Summary:    Electronics manufacturers are considering the use of 

non-lead bearing materials in the interconnects on their Printed Wiring

Assemblies (PWAs).  The EMPF's Conductive Adhesives project will help

industry overcome the barriers that stand between implementing conductive

adhesives and non-lead bearing alloys as a replacement for lead solders in

surface mount technology assemblies.



In an earlier study, the EMPF examined the ability to produce assemblies

using conductive adhesives, and the electrical and mechanical

characteristics of conductive adhesives.  The current project will expand

on the EMPF's previous work in this area, demonstrating the production of

industry product using lead solder replacements, and will focus on use of

lead solder replacements in military and commercial products.



The EMPF is forming a team of electronics companies who have common

manufacturing concerns, to maximize the possibility of successfully

implementing conductive adhesives on production lines.  Specific efforts

include using off-the-shelf alloys and conductive adhesives in current

designs as both a drop-in replacement and as a complete redesign 

incorporating material and process design improvements.



Project Keywords: electronics, manufacture, lead, wiring, conductive,

adhesive, alloy, solder



Organization Performing Research: Electronics Manufacturing Productivity

Facility (EMPF)



Primary Research Contact:

John Guy

Electronics Manufacturing Productivity Facility (EMPF)

714 North Senate Avenue

Indianapolis, Indiana 46202-3112

Phone:  (317) 226-5630   FAX:  (317) 226-5615

Internet:



Date Research Started/Completed:  Ongoing



Publications Based on Research:

NOTE:  all publications with EMPF designations are available by calling

317-226-5607



EMPF PP0011-  Dealing with the Issues of Lead Solder Replacement-May 1995



Approximate Project Budget:     Not available



Primary Project Funder:  Electronics Manufacturing Productivity Facility

(EMPF)



Funder Contact:

William J. Baldwin, Manager, Technology Transfer

Electronics Manufacturing Productivity Facility (EMPF)

714 North Senate Avenue

Indianapolis, Indiana 46202-3112

Phone:  (317) 226-5688   FAX:  (317) 226-5615

Internet:   http://www.engr.iupui.edu/empf/